Advanced Ceramic Substrate Solutions for Power Modules and Advanced Packaging
Ceracore Technologies supports APAC customers with DBC, DPC, AMB and HTCC solutions for power semiconductor, optoelectronic and high-reliability packaging applications..
About Ceracore Technologies
Ceracore Technologies is a Singapore-based company focused on advanced ceramic substrate and packaging solutions for power semiconductor, optoelectronic and high-reliability electronic applications.
Our Focus
Delivering reliable DBC, DPC, AMB, and HTCC solutions tailored for APAC industries.
Our Services
Ceracore provides reliable ceramic solutions for high-performance electronics.
DBC Substrates
High thermal conductivity substrates designed for efficient power module cooling.
DPC Substrates
Optimized for compact, high-density power electronics applications.
Advanced multilayer ceramic substrates supporting robust device integration.
AMB Substrates
Our Projects
Showcasing ceramic substrate solutions tailored for APAC industries.
DBC Modules
High thermal conductivity substrates for power electronics.
DPC Substrates
Durable ceramic substrates optimized for reliability.
AMB Solutions
Advanced metal base substrates for rugged applications.
HTCC Packages
Hermetic ceramic packages for critical electronics.
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Gallery
Snapshots of our advanced ceramic substrates and packaging solutions.
Contact Us
Reach out to discuss your advanced ceramic substrate and packaging needs with us.
Stay Updated
Get the latest on ceramic substrate innovations
Contact
Reach out for inquiries or support anytime.
Phone
victor@cerecoreech.com
WhatsApp +65 9010 7238
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