Advanced Ceramic Substrate Solutions for Power Modules and Advanced Packaging

Ceracore Technologies supports APAC customers with DBC, DPC, AMB and HTCC solutions for power semiconductor, optoelectronic and high-reliability packaging applications..

About Ceracore Technologies

Ceracore Technologies is a Singapore-based company focused on advanced ceramic substrate and packaging solutions for power semiconductor, optoelectronic and high-reliability electronic applications.

Close-up of advanced ceramic substrate with intricate circuit patterns under soft lighting.
Close-up of advanced ceramic substrate with intricate circuit patterns under soft lighting.
Technician inspecting ceramic packaging components in a cleanroom environment.
Technician inspecting ceramic packaging components in a cleanroom environment.
Array of ceramic substrates and packages neatly arranged on a white surface with blue-gray accents.
Array of ceramic substrates and packages neatly arranged on a white surface with blue-gray accents.

Our Focus

Delivering reliable DBC, DPC, AMB, and HTCC solutions tailored for APAC industries.

Our Services

Ceracore provides reliable ceramic solutions for high-performance electronics.

DBC Substrates
Close-up image of a copper-backed DBC ceramic substrate used in power modules.
Close-up image of a copper-backed DBC ceramic substrate used in power modules.

High thermal conductivity substrates designed for efficient power module cooling.

Precision-crafted DPC ceramic substrate highlighting smooth surface finish.
Precision-crafted DPC ceramic substrate highlighting smooth surface finish.
Assembly of AMB ceramic substrates showcasing compact packaging design.
Assembly of AMB ceramic substrates showcasing compact packaging design.
DPC Substrates

Optimized for compact, high-density power electronics applications.

Advanced multilayer ceramic substrates supporting robust device integration.

AMB Substrates

Our Projects

Showcasing ceramic substrate solutions tailored for APAC industries.

Close-up of a power module using advanced ceramic substrates in a cleanroom environment.
Close-up of a power module using advanced ceramic substrates in a cleanroom environment.
DBC Modules

High thermal conductivity substrates for power electronics.

Technician inspecting DPC ceramic substrates under precision lighting.
Technician inspecting DPC ceramic substrates under precision lighting.
DPC Substrates

Durable ceramic substrates optimized for reliability.

Automotive electronic assembly featuring AMB ceramic substrate integration.
Automotive electronic assembly featuring AMB ceramic substrate integration.
High-reliability HTCC ceramic packages arranged for quality testing.
High-reliability HTCC ceramic packages arranged for quality testing.
AMB Solutions

Advanced metal base substrates for rugged applications.

HTCC Packages

Hermetic ceramic packages for critical electronics.

Close-up of a high-precision ceramic substrate with intricate circuit patterns under bright lighting.
Close-up of a high-precision ceramic substrate with intricate circuit patterns under bright lighting.

Gallery

Snapshots of our advanced ceramic substrates and packaging solutions.

Engineered ceramic packages arranged neatly on a clean white surface, highlighting their smooth finish.
Engineered ceramic packages arranged neatly on a clean white surface, highlighting their smooth finish.
Technician inspecting a power module assembly featuring ceramic substrates in a controlled lab environment.
Technician inspecting a power module assembly featuring ceramic substrates in a controlled lab environment.
Macro shot of a ceramic substrate with visible thermal interface layers and fine metallization.
Macro shot of a ceramic substrate with visible thermal interface layers and fine metallization.

Contact Us

Close-up of a technician inspecting a ceramic substrate under bright lab lighting.
Close-up of a technician inspecting a ceramic substrate under bright lab lighting.

Reach out to discuss your advanced ceramic substrate and packaging needs with us.

Stay Updated

Get the latest on ceramic substrate innovations